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Innovative Wafer Dicing Solutions
for Semiconductor Packaging

Optimized for SiC and GaN wafers, KNJ’s advanced dicing technology combines high-speed precision with mass production readiness.

KNJ specializes in silicon and compound semiconductor packaging, offering advanced dicing technologies optimized for compound semiconductor wafers such as SiC and GaN. We operate a pilot line and conduct ongoing research and development to improve cutting speed and ensure surface quality for mass production.

Through our pilot line, we not only develop products but also possess the capability to respond to mass production needs. In particular, we have resolved the high hardness issue of SiC wafers and secured high-quality, high-speed processing technologies.